2024
2024

Research Policy & IP Framework:

Strengthen policies for IP and IC design protection. Identify research thrusts (e.g., Semiconductor Devices, VLSI, RF/Wireless Communications, Embedded Systems).

2025
2025

Seed Funding & Partnership Building:

Launch internal seed fund for chip design and communications projects. Establish 2+ MOUs with semiconductor and telecom companies for R&D.

2026
2026

Project Commercialization & International Collaboration:

Target 1-2 patent/utility model applications for circuit designs. Pursue joint international research on semiconductor materials and 6G technologies.

2027
2027

Research Center Establishment & Sustained Funding:

Establish a dedicated research center (e.g., Center for Microelectronics and Wireless Communications). Secure sustained external funding (DOST, DICT).

2028
2028

Ecosystem Integration & Impact Assessment:

Fully integrate into the national and global semiconductor ecosystem. Publish a comprehensive impact assessment of research and commercialization.